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Shuttle upgrades XPC nano models with Kaby Lake processors

Tags: Shuttle, Intel (NASDAQ:INTC)

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  • Higher performance, less energy consumption and DDR4 memory
  • Barebone PCs with four different CPU versions available

Elmshorn, Germany, 06/07/2017 – As the third generation of the "XPC nano" series, which was originally introduced in 2015, four new models are now being added to the product range. The seventh generation of Intel Core processors (Kaby Lake) boosts the level of performance while simultaneously reducing the energy consumption once again.

The core components supplied with the NC03 barebone models are the chassis, mainboard, cooling system and the power supply unit. Choosing a model will also determine the particular processor, which is already soldered on the mainboard – either a Celeron, Core i3, Core i5 or Core i7. The base model NC03U features an Intel Celeron 3865U dual-core processor clocked at 2x 1.8 GHz. The tried-and-tested 14 nm architecture and power consumption of just 5 Watt in idle mode represent a particularly high level of energy efficiency.

Like the previous range of NC02 models, the chassis dimensions here are 141 x 141 x 42 mm and can accommodate one 2.5-inch drive with a maximum height of 15 mm. When undoing the two screws of the covers of the black chassis, space for the above mentioned 2.5-inch drive in the form of a high-capacity hard disk or SSD comes to light. Two SO-DIMM sockets can be fitted with up to 32 GB of DDR4 memory in total. In addition, one free M.2 expansion slot is available and, thanks to it being PCIe, it supports fast NVMe cards with a length of 80 mm. A second M.2 slot is already equipped with a WLAN module.

There is also a single-fan heatpipe cooling system working quietly inside. An external 65 W power supply unit provides all of the power.

A bootable SD card reader is part of the front panel and completes it together with one USB 3.0 Type A and C connector each.

Furthermore, the back panel boasts a DisplayPort connector, HDMI 1.4b, Gigabit Ethernet, USB and two perforations for WLAN antennas, if required. An RS-232 connector at the side is intended for commercial applications and further expands the possible fields of use of the NC03 series.

Fluent playback of ultra UD, 4K content (3840 x 2160 pixels) is possible right from the base model NC03U and happens at 60 Hz via DisplayPort, while it is 30 Hz for HDMI.

"The NC03 models now bring the seventh generation of Intel Core processors to our smallest devices and nearly complete the transition from Skylake to Kaby Lake throughout the product range,” explains Tom Seiffert, Head of Marketing & PR at Shuttle Computer Handels GmbH.

All versions can be operated in different positions; for example, standing upright with the aluminium stand or mounted to suitable surfaces and monitors using the VESA mount. Both the stand and VESA mount are included as standard.

Model overview

  • NC03U with Intel Celeron 3865U (2 cores, 2 threads, 2 MB cache) and Intel HD Graphics 610
  • NC03U3 with Intel Core i3-7100U (2 cores, 4 threads, 3 MB cache) and Intel HD Graphics 620
  • NC03U5 with Intel Core i5-7200U (2 cores, 4 threads, 3 MB cache) and Intel HD Graphics 620
  • NC03U7 with Intel Core i7-7500U (2 cores, 4 threads, 4 MB cache) and Intel HD Graphics 620

The recommended retail price from Shuttle for the XPC nano NC03U is EUR 148.00, the NC03U3 sells for EUR 334.00, the NC03U5 has a price tag of EUR 407.00 and the NC03U7 costs EUR 534.00 (all ex VAT). All models mentioned are available from specialist retailers Europe-wide upon publication of this press release.

About Shuttle

Established in 1983 in Taiwan, Shuttle Inc. specialises in the development and production of space-saving Mini-PCs. The stock market listed company is represented globally through subsidiaries in Germany, the USA, China and Japan. Since 2001 attractive PC solutions in an array of formats designed for virtually every area of application have been the main business focus of Shuttle. The company aims to develop individual solutions for the demanding requirements of its customers. Technical innovations such as new chipsets, processors and connectors are regularly integrated in new models within a short time of product launch. The range of products has recently been expanded to include high-performance fanless slim PCs.