INTEL INTRODUCES WORLD'S HIGHEST PERFORMANCE FLASH

INTEL INTRODUCES WORLD'S HIGHEST PERFORMANCE FLASH
MEMORY FOR INTERNET-ENABLED CELL PHONES

Intel Discusses Innovative Flash Memory Packaging

Techniques at Intel Developer Forum in Japan

INTEL DEVELOPER FORUM, TOKYO, April 17, 2002 - Intel
Corporation today introduced the world's highest performance flash memory for
cell phones and detailed innovative flash memory packaging techniques. The
Intel® 1.8 Volt Wireless Flash memory is built on Intel's industry-leading 0.13
micron process technology and is up to four times faster than existing flash
solutions. This increased performance results in higher data throughput rates
that speed up data-intensive Internet phone applications such as browsing,
streaming multimedia and text messaging. The new chip also consumes less power
than standard flash chips, resulting in extended battery life.

"Flash memory plays a vital role in Internet-enabled
phones," said Ron Smith, senior vice president and general manager of Intel's
Wireless Communications and Computing Group, at the Intel Developer Forum (IDF).
"As more data-intensive Internet applications are operated on cell phones,
higher densities of high-performance, low-power flash memory are required, and
Intel is leading the charge to produce them."

The Science of Flash Packaging

Intel also disclosed innovative flash memory packaging
techniques at IDF that will enable high-performance memory in smaller cell
phones. These techniques include stacking multiple, high-density memory and
memory-logic chips in a single package, and stacking folded packages that
accommodate higher levels of multi-die integration and memory density in a
smaller space. Packaging techniques are crucial in a small form factor device
such as a cell phone, where higher levels of memory are required but board space
is at a minimum. Intel will begin sampling flash memory using this folded and
stacked packaging technique later this year.

"In addition to manufacturing flash at 0.13 micron that
is one product generation ahead of our competitors, Intel, the leading flash
supplier, also provides world-class packaging solutions from single die to
integrated multi-die subsystems," said Darin Billerbeck, vice president of
Intel's Wireless Communications and Computing Group and general manager of
Intel's Flash Products Group.

Wireless Devices: Anywhere, Anytime

Intel's wireless products are built around three core
technologies: Intel Wireless Flash memory, the Intel® XScale(tm)
microarchitecture for applications processing and the Intel® Micro Signal
Architecture for signal processing. These technologies are optimized for higher
performance and lower power consumption for users of wireless devices and are
the key ingredients of the Intel® Personal Internet Client Architecture, Intel's
development blueprint for designing wireless handheld communication products
that combine voice communications and Internet access capabilities.

Intel 1.8 Volt Wireless Flash Memory: Pricing and
Availability

The Intel 1.8 Volt Wireless Flash memory will be
available in 64- and 32-Mbit densities. The 64-Mbit density is currently
sampling and will be in production in August, while the 32-Mbit density will
sample in June and be in production in October. A 128-Mbit density chip will
also sample later this year and be in production in 2003. In 10,000- unit
quantities, the 64-Mbit density is priced at $14.91, and the 32-Mbit density is
priced at $8.97. The chip is currently in production on a 0.18 micron version in
all three densities.

About IDF

Intel, the world's largest chip maker, is also a leading
manufacturer of computer,