INTEL DRIVING INDUSTRY LEADING TECHNOLOGY AND INITIATIVES FOR WIDE ARRAY OF CLIENT DEVICES

INTEL DEVELOPER FORUM, SAN
FRANCISCO, Feb. 27, 2002 - Intel Corporation today highlighted innovative new
technologies that will deliver better experiences for users of desktop
computers, mobile PCs and wireless computing devices.

The technologies include Intel’s
next generation desktop processor and the forthcoming mobile Intel® Pentium® 4
processor - M, along with details of 2.5 and 3G communications processors for
wireless devices.

Intel executives, in remarks at
the Intel Developer Forum, Spring 2002, also outlined the progress of several
industry initiatives such as 3GIO, a high speed interconnection technology
between devices within the computer; the Intel® Personal Client Architecture (PCA)
developer network, a support network for wireless developers; and a new Mobility
Enabling Program, designed to enhance the future of mobile PCs.

In remarks to the developer
community, Louis Burns, vice president and co-general manager, Desktop Platforms
Group disclosed plans for Intel’s upcoming desktop processor, code-named
Prescott. The processor, slated for 2003, is Intel’s next generation processor
based on the Intel® NetBurst™ microarchitecture. Prescott will, among other
things, include Hyper-Threading technology, an Intel technology that allows
operating systems to view a single physical processor as if it were two,
significantly increasing platform performance. Additionally, Burns demonstrated
a Pentium 4 processor running at clock rates up to 4 GHz.

"The Intel® Pentium® 4 processor
has become the desktop platform of choice for both consumers and business," said
Burns. "Intel is driving a number of innovative technologies over the next year
that will accelerate the digital convergence at home and continue to enhance our
desktop platform capabilities, including higher performing processors and
revolutionary new form factors."

Burns discussed technology that
enables small form factor computer systems without comprising performance or
scalability. He announced a new initiative to standardize form factors for
systems based on 3GIO building blocks. Intel plans to support the 3GIO
architecture across a wide range of product segments with initial silicon
scheduled to be available in the second half of 2003.

Anand Chandrasekher, vice
president and general manager, Mobile Platforms Group, highlighted Intel’s
efforts in the mobile market and outlined the future of mobile PCs where secure
wireless connectivity, high performance and increased battery life offer a
variety of new usage models for consumer and business. He urged the industry to
design technologies and mobile PCs that address and reinforce this vision and
announced the Intel Mobility Enabling Program, an Intel-led initiative to bring
the industry together to create guidelines for a new generation of mobile
computers.

"Intel is leading the industry to
support the Mobility Enabling Program," said Chandrasekher. "Together the
industry can deliver exciting new platforms that meet the promise of anytime,
anywhere computing and secure connectivity."

Additionally, Chandrasekher
discussed technical benefits of the forthcoming mobile Intel Pentium 4 Processor
- M and demonstrated the processor's performance with the first public
demo of a soft decode of 1080i (HDTV quality) content on a notebook PC.
While incorporating all the advanced technologies of its desktop counterpart,
the mobile Intel Pentium 4 Processor - M will also include mobile-specific
features such as Enhanced SpeedStep™ technology, and Deeper Sleep for low power
state and small mobile packaging for thinner, lighter mobile PCs.

Banias, the code name for Intel’s
next generation mobile processor architecture, will also incorporate these
technologies along with other innovative features designed specifically for
mobile computing. Banias will be available in the first half of 2003 and will be
based on a new core chip design. Chandrasekher demonstrated a working sample of
a chipset, code named Odem, designed for the mobile market segment, which will
be introduced along with the Banias processor.

Ron Smith, Intel senior vice
president and general manager, Wireless Communications and Computing Group,
focused developers’ attention on Intel’s wireless client product strategy.
Intel’s wireless products are built around three core technologies -- the Intel®
XScale™ microarchitecture for applications processing, the Intel® Micro Signal
Architecture for signal processing and Intel Wireless Flash Memory. These
technologies are optimized for higher performance and lower power consumption
for users of wireless devices. These technologies are the key ingredients of the
Intel® Personal Internet Client Architecture, Intel’s development blueprint for
designing wireless handheld communication products that combine voice
communications and Internet access capabilities.

Future wireless technology from
Intel will integrate communications functions, outstanding processing power and
leadership memory features onto a single "Wireless Internet on a Chip," -- the
foundation for Intel’s GSM/GPRS (2.5G) and WCDMA (3G) communications processors
currently under development. Intel has a 3G communications processor test chip
in its labs and will be introducing a 2.5G version based on the Wireless
Internet on a Chip technology later this year.

"Our next-generation technology
will provide new levels of performance at low levels of power to enable a class
of wireless Internet applications that will help drive the next wave of growth
for the wireless industry," said Smith.

Smith introduced Intel PCA
hardware and software developer kits for generating Intel PCA-optimized devices
and applications. The software kit features a full tool suite for IBM WebSphere
Everyplace Embedded Software optimized for Intel PCA. The Intel PCA Developer
Network offers wireless companies development, technical and marketing support
for designing cell phones, personal digital assistants and other mobile Internet
devices and applications supporting Intel PCA. To date, more than 600 companies
have joined the network and have access to its more than 400 hardware and
software design tools.

The Intel Developer Forum is the
technology industry's premier event for hardware and software developers. Held
worldwide throughout the year, IDF brings together key industry players to
discuss cutting-edge technology and products for PCs, servers, communications
equipment, and handheld clients. For more information on IDF and Intel
technology, visit http://developer.intel.com.

Intel, the world’s largest chip
maker, is also a leading manufacturer of computer, networking and communications
products. Additional information about Intel is available at www.intel.com/pressroom.