
2 April 2013, 15:30
Milestone in readying processor for production using TSMC’s 16nm FinFET tech.

1 April 2013, 12:00
Company is readying tenfold expansion of its IC R&D team.

28 March 2013, 15:13
Two new Direct X extensions and more innovations detailed.

20 March 2013, 11:22
Progress from Tegra 2 to Tegra 6 will represent a “100x” performance improvement.
19 March 2013, 09:30
Is it worth waiting for?

28 February 2013, 12:30
More eye candy on mobile platforms.

22 February 2013, 15:19
Will it be another AMD APU design win?

21 February 2013, 16:00
Automatically adjusts an AMD APU-powered hybrid tablet’s performance.

20 February 2013, 13:40
Previously known as Project Grey, the chip is specifically targeted at smartphones.

15 February 2013, 15:39
He wants to remind us about Intel’s dirty tactics during the noughties.

14 February 2013, 10:15
However forecasts for Q1 2013 are lower than expected.

5 February 2013, 09:44
Surfing upon the wave of smartphone and tablet popularity.

30 January 2013, 11:00
Clock speeds and more details about Trinity’s successor.

28 January 2013, 15:50
We should see some NVIDIA devices made by AIB partners at Computex in June.

23 January 2013, 11:12
Chipzilla will focus on new reference designs for EFF, all-in-ones, ultrabooks and tablets.

22 January 2013, 17:30
Launches before and is then showcased at Computex Taipei 2013.

22 January 2013, 13:15
Two senior engineers hired from Qualcomm and Apple.

17 January 2013, 10:02
And Apple will reportedly switch A6X production from Samsung to TSMC.

10 January 2013, 12:35
Will this be the power behind the Samsung Galaxy S IV?

9 January 2013, 10:19
Four performance segments from entry level to “super-premium”.

8 January 2013, 11:17
Alongside "Temash" and "Kabini" company also presents a new APU codenamed “Richland”.

8 January 2013, 10:18
Also touch is to become a mandatory feature of 4th gen Ultrabooks.

27 December 2012, 16:30
Michael Goddard was AMD’s corporate VP for product design engineering.

18 December 2012, 17:00
New SoC, codenamed Wayne, includes a 4-PLUS-1 Cortex-A15 CPU and 72-core GPU?
13 December 2012, 13:45
Datasheet suggests Intel's continuing to push-down power consumption.

12 December 2012, 09:45
“First low-power SoC with server-class features offering as low as 6W TDP”.
10 December 2012, 09:09
Brings affordability to the optical data market.

6 December 2012, 11:30
Also AMD has "no plans at this time to move to BGA only packaging".
4 December 2012, 09:44
Low-power options down to 25 watts.

28 November 2012, 11:11
Rumours and leaked roadmap from Japan say “Hai” (yes).
23 November 2012, 12:15
Enhancements to the clock mesh may have paid off.
20 November 2012, 11:45
A focus on 3D video, USB 3.0 host and a shift in peripheral allocations.
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