OCZ Technology Announces the First Products to Implement the New OCZ XTC Heatspreader
Sunnyvale, CA October 25, 2005: OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, is extremely excited to announce the PC-3200 and PC-3500 Gold GX series modules which will be the first two products to utilize the latest OCZ heatspreader design. The new, patent-pending XTC (Xtreme Thermal Convection) Heatspreaders allow increased ventilation and heat dissipation due to an innovative honeycomb design providing more direct access to the actual memory ICs.
“Memory modules that implement conventional, solid heatspreaders provide sufficient heat dissipation but do not adequately address the build up of heat pockets; The new Xtreme Thermal Convention Heatspreader design tackles this problem and more," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "
The PC-3200 and PC-3500 Gold Gamer eXtreme Series with 2-2-2-5 timings will be the first OCZ memory parts to include the new XTC heatspreader.
