Breisach, Germany, March 07, 2007 – Memorysolution announces immediate availability of Infinity DDR2 memory manufactured by OCI. The new DRAM is produced in a unique and patented new procedure. Optically very appealing and fully RoHS compliant, in the D-A-CH region (Germany, Austria, Switzerland) the memory modules are available exclusively through Memorysolution.

Optimum Care Internationally Tech. Inc. (OCI) has developed this patented packaging technology to overcome the physical limitations of currently applied chip package methods like TSOP (Thin Small Outline package) or BGA (Ball Grid Array) in memory chip production. With new CPU generations like Intel's Core 2 Duo or AMD AM2, DDR2 memory will become mainstream. These processor types no longer support DDR memory, soon making DDR2 the prevailing technology. Clock speeds of DDR2 modules need to keep pace with ever-rising CPU speeds. The permanent challenge for DRAM manufacturers is not only to cope with but also to overcome certain physical limitations. To achieve optimum performance of DRAM modules sporting best-of-breed electrical characteristics as well as an advanced thermal design, the application of more and more efficient materials and innovative technologies simply has become a must for any manufacturer.

Certified to ISO-14000 and ISO-9001 already since the year 2005, OCI focuses their R&D efforts and core competences in particular in the area of in-house package design and PCB design straight on the improvement of the parameters crucial to achieve these goals in DRAM production. That way it was possible to design DDR2 memory modules with an optimal performance and a significantly reduced thermal resistance. In the result, the worldwide unique Turbo Chip Scale Package (TCSP) protected by more than 200 patents has significant advantages over current DRAM production procedures.

Shorter circuit lengths reduce undesirable crosstalk as well as switching noise of the modules and provide for an improved signal quality also at high memory clock speeds. Opposed to epoxy resins known for their bad heat conduction usually applied in chip packaging, TCSP allows the bared chip to emit heat directly outward to the environment. Moreover, substances such as thermal adhesive and metal protective caps additionally protecting the die mechanically are installed on the modules when packaging the dies, thus adding to the substantially better heat dissipation of TCSP packed modules.

These combined measures easily allow heat from the memory modules to ventilate to the surrounding air inside the system, from where this loss heat can be conducted outside the PC case by common system ventilation measures in a very effective manner, a not unimportant fact when it comes to high memory clock speeds.

As all DDR2 modules, Infinity DRAM sports the general advantage of having a lower voltage (1.8V) than that of DDR (2.5V). The lower level of power consumption adds to the effect of a better heat dissipation, but also reduces AC power consumption in working environments with high CPU populations as for example in server farms. Besides, stringent disk-burning tests have shown that system failures due to overheating of the DRAM are significantly reduced when using TCSP packaged memory modules. That way TCSP improves the overall system availability and protects your investments in IT.

OCI Infinity modules have already been certified by leading appliance and mainboard manufacturers (e.g., for the application in servers made by Tyan) and by Advanced Validation Labs, Inc (AVL) which itself are officially approved by Intel. As of now, the modules are available as DDR2-533 up to DDR2-800 unbuffered DIMM with SPD timings of 5-5-5-15 and in capacities up to 1 GB. Higher capacities and clock speeds are scheduled to follow later this year. Of course, OCI also manufactures all standard products in TSOP and BGA technology.